FISCHER ELEKTRONIK ICK BGA 10 X 10 X 10 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28.5 °C/W, 10 mm, 10 mm, 10 mm

FISCHER ELEKTRONIK ICK BGA 10 X 10 X 10 Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28.5 °C/W, 10 mm, 10 mm, 10 mmThis is a Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28. 5 C W, 10 mm, 10 mm, 10 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 10 X 10 X 10Product details Packages Cooled BGA Thermal Resistance 28. 5C W External Height Metric 10mm External Width Metric 10mm External Length Metric 10mm External Diameter Metric Heat Sink Material Aluminium External Height Imperial 0. 39" External Width Imperial 0. 39" External Length Imperial

This is a Heat Sink, Square, PCB, For Ball Grid Arrays, BGA, 28.5 °C/W, 10 mm, 10 mm, 10 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 10 X 10 X 10

Product details

Packages Cooled	BGA
Thermal Resistance	28.5°C/W
External Height - Metric	10mm
External Width - Metric	10mm
External Length - Metric	10mm
External Diameter - Metric	-
Heat Sink Material	Aluminium
External Height - Imperial	0.39"
External Width - Imperial	0.39"
External Length - Imperial	0.39"
External Diameter - Imperial	-
Product Range	-

Other details

Brand	FISCHER ELEKTRONIK
Part Number	ICK BGA 10 X 10 X 10
Quantity	Each
Technical Data Sheet EN

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