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Shipping Estimate
USA
- USA
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- USA
- CAN
Ships within 48 hours · Estimated delivery Aug 2 - Aug 7
Promo Codes Available:
For Your Every Summer RSVP, with Code: SUMMER15
Description
AMAOE Mbga-B14 Android Phone CPU Tin Planting Glue Remova KitsAMAOE Reballing Stencil Station Kits for Reballing Stencil Station Kits for Reballing Stencil Station Kits. AMAOE Mbga B13 IP13 4 in 1 middle layer tin planting station is suitable for iPhone13 13Pro Pro Max mini Tin Mesh. Amaoe Mbga B14 BGA Reballing Stencil For Samsung Exynos CPU Reballing Stencil CPU Stencil. Features: 1. AMAOE Mbga B1 10 IN 1 Middle layer reballing stencil kits for iphone X XS XSMAX 11 12 11Pro Max 12MINI. 2. AMAOE Mbga B2 for
AMAOE Reballing Stencil Station Kits for Reballing Stencil Station Kits for Reballing Stencil Station Kits. AMAOE Mbga-B13/IP13 4 in 1 middle layer tin planting station is suitable for iPhone13/13Pro/ Pro Max/mini Tin Mesh. Amaoe Mbga-B14 BGA Reballing Stencil For Samsung Exynos CPU Reballing Stencil CPU Stencil.
Features:
1. AMAOE Mbga-B1 10 IN 1 Middle layer reballing stencil kits for iphone X XS XSMAX 11 12 11Pro/Max 12MINI.
2. AMAOE Mbga-B2 for iphone A8 A9 A10 A11 A12 A13 CPU Positioning Plate Steel Mesh Planting Tin Delete Glue Platform Fixed Fixture.
3. AMAOE Mbga-B3 tin planting station/mobile phone font/hard disk/memory/7 in 1/positioning board/steel mesh.
4. Amaoe Mbga-B4 positioning platform for iphone 11/12 pro CPU A13 A14 NAND BASEBAND CPU WIFI IC chip BGA Reballing stencils.
5. AMAOE MBGA-B5 planting tin platform/Android phone CPU/ planting tin/glue removal/positioning board /CPU steel mesh.
6. AMAOE MBGA-B6 planting tin platform/Android phone CPU/ planting tin/glue removal/positioning board /CPU steel mesh.
7. AMAOE MBGA-B7 planting tin platform/Android phone CPU/ planting tin/glue removal/positioning board /CPU steel mesh.
8. Amaoe Mbga-B8 BGA Reballing Platform for Android CPU SM7250 7350 6150 MSM8952 8909 MT6761 6762 6765 Glue Removing.
9. AMAOE Mbga-B9 BGA Reballing Stencil Platform For Android Phone CPU Planting Tin Glue Removal Positioning Board CPU Steel Mesh.
10. AMAOE Mbga-B10 Tin Planting Station for Android phone CPU HI6260/9500 planting tin glue removal positioning board CPU steel mesh.
11. AMAOE Mbga-B11 for iPhone A8-A14/CPU/ tin planting platform/glue removal/positioning plate/steel mesh.
12. AMAOE Mbga-B12 BGA Reballing Stencil Platform For IPhone A8-A15 CPU Planting Tin Glue Removal Positioning Board CPU Steel Mesh.
13. AMAOE Mbga-B13/IP13 4-In-1 Middle-Level Tin Planting Station Is Suitable for IPhone13/13Pro/Pro Max/mini Tin Mesh.
14. Amaoe Mbga-B14 BGA Reballing Stencil tin planting table For Samsung Exynos CPU removal glue positioning plate CPU steel mesh,CPU Exynos 9820 9815 9611 9609 9610 8895 8890 7904 7884 7885 7880 7870 7580 7570 7420 3475 1080 980 880.
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy